E ʻike i ka ʻōnaehana CM1126B-P ma ka Module a hoʻokuʻu i kona mana piha me kēia manual mea hoʻohana piha. E komo i loko o nā kikoʻī kikoʻī, alakaʻi hoʻolālā ʻenehana, a hoʻomaikaʻi i nā ʻōlelo aʻoaʻo no kahi ʻike ʻōnaehana hoʻokomo ʻia.
Detailed hardware manual for the Boardcon Android210 embedded computer, featuring the Samsung S5PV210AH ARM Cortex-A8 processor, specifications, peripheral interfaces, and configuration options.
Detailed user manual for the Boardcon Compact3566, a mini single board computer featuring the Rockchip RK3566 processor, Quad-core Cortex-A55, Mali-G52 GPU, and NPU, designed for AIoT and embedded applications. Includes hardware design guides, pin definitions, and electrical characteristics.
Step-by-step instructions for burning firmware images, including uboot and Android system files, to the iNand storage of the Boardcon EM210 embedded system running Android 4.0.3.
Comprehensive hardware user manual for the Boardcon CM1126B-P System-on-Module (SoM), featuring Quad-core Cortex-A53, NPU, RISC-V MCU, and extensive peripheral support for IPC, AI cameras, and embedded systems. Includes specifications, pin definitions, and electrical characteristics.
E ʻike i ka advantages o Computer-on-Modules (COMs) me ka pepa keʻokeʻo a congatec. E aʻo e pili ana i nā pōmaikaʻi koʻikoʻi e like me ka wikiwiki o ka manawa-i ka mākeke, hoʻemi ʻia nā kumukūʻai, a me ka scalability, me nā kūlana kaulana e like me COM Express a me COM-HPC no ka hoʻopili ʻana a me ka hoʻopili ʻana.
SEGGER announces that its J-Link debug probes and Flasher programmers now support Arm China's new STAR-MC3 CPU IP, enabling developers to leverage SEGGER's robust embedded development tools for advanced AIoT applications. Learn more about SEGGER's comprehensive ecosystem.
ʻO kahi hoʻopau pihaview of embedded operating systems, tracing their history, evolution, and critical role in the development of the Internet of Things (IoT). The book covers various operating systems, their architectures, applications, and future trends, including discussions on open-source solutions, mobile platforms, security, and emerging technologies like RISC-V.
Explore the Microsemi Fusion Webserver demonstration using uIP and FreeRTOS on the M1AFS-EMBEDDED-KIT. This guide covers setup, design, and interactive features for embedded system development.
A comprehensive checklist outlining 5 key factors for successfully deploying Yocto for production-grade embedded and IoT devices, covering maintainability, security, reliability, visibility, and reusability.
He alakaʻi holoʻokoʻa mai Future Designs, Inc. (FDI) no ka hoʻomohala ʻana i nā mea hoʻohana kiʻi kiʻi (GUI) no nā ʻōnaehana hoʻokomo ʻia me ka hoʻohana ʻana i ka paepae µEZ a me ka waihona emWin. E aʻo i ka hoʻonohonoho ʻana i kāu kaiapuni hoʻomohala, hoʻohui i ka ʻenehana, a kūkulu i likeample noi me ka UEZGUI-1788-43WQR.
A comprehensive guide for developers on setting up and using the Renesas RZ/A2M Software Package with Renesas e² studio. Learn to import projects, build, debug, and integrate drivers and middleware for embedded system development.
E ʻimi i ka DFI EC700-ASL a me EC710-ASL, nā ʻōnaehana hoʻokomo ʻole ʻia e ka Intel® Processor Industrial RE Series CPUs. Hōʻike kēia palapala i nā hiʻohiʻona nui, nā kikoʻī kikoʻī, ka pilina I/O, nā ana, a me ka ʻike kauoha no kēia mau kamepiula ʻoihana ikaika.
